Krishnamoorthy, Ahila: search on Z-Library

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1

Electromigration behavior of dual-damascene Cu interconnects––Structure, width, and length dependences

A.V Vairagar, S.G Mhaisalkar, Ahila Krishnamoorthy

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 498 KB

english, 2004

2

A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects

M.Y. Yan, K.N. Tu, A.V. Vairagar, S.G. Mhaisalkar, Ahila Krishnamoorthy

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 221 KB

english, 2006

3

Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures

Vairagar, A. V., Mhaisalkar, S. G., Meyer, M. A., Zschech, E., Krishnamoorthy, Ahila, Tu, K. N., Gusak, A. M.

Journal:

Applied Physics Letters

Year:

2005

Language:

english

File:

PDF, 457 KB

english, 2005

4

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California (Sunday 21 February 2010)] Extreme Ultraviolet (EUV) Lithography - Characterization of line-edge roughness (LER) propagation from resists: underlayer interfaces in ultrathin resist films

George, Simi A., Naulleau, Patrick P., Krishnamoorthy, Ahila, Wu, Zeyu, Rutter, Jr., Edward W., Kennedy, Joseph T., Xie, Song Yuan, Flanigan, Kyle Y., Wallow, Thomas I., La Fontaine, Bruno M.

Year:

2010

Language:

english

File:

PDF, 8.06 MB

english, 2010

5

Performance properties in thick film silicate dielectric layers using molecular modeling

Nancy Iwamoto, Ahila Krishnamoorthy, Richard Spear

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 995 KB

english, 2009

6

Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects

V.C. Ngwan, Chunxiang Zhu, Ahila Krishnamoorthy

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 340 KB

english, 2004

7

Effect of Cu[sub 3]Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects

Yan, M. Y., Suh, J. O., Ren, F., Tu, K. N., Vairagar, A. V., Mhaisalkar, S. G., Krishnamoorthy, Ahila

Journal:

Applied Physics Letters

Year:

2005

Language:

english

File:

PDF, 724 KB

english, 2005

8

Study of leakage mechanisms of the copper/Black Diamond™ damascene process

K.Y. Yiang, Q. Guo, W.J. Yoo, Ahila Krishnamoorthy

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 236 KB

english, 2004

9

Effect of interface strength on electromigration-induced inlaid copper interconnect degradation: Experiment and simulation

Zschech, Ehrenfried, Engelmann, Hans-Jürgen, Meyer, Moritz Andreas, Kahlert, Volker, Vairagar, Anand V., Mhaisalkar, Subodh G., Krishnamoorthy, Ahila, Yan, Minyu, Tu, K. N., Sukharev, Valeriy

Journal:

Zeitschrift für Metallkunde

Year:

2005

Language:

english

File:

PDF, 370 KB

english, 2005

10

Confinement of electromigration induced void propagation in Cu interconnect by a buried Ta diffusion barrier layer

Yan, M. Y., Tu, K. N., Vairagar, A. V., Mhaisalkar, S. G., Krishnamoorthy, Ahila

Journal:

Applied Physics Letters

Year:

2005

Language:

english

File:

PDF, 551 KB

english, 2005

11

Investigation of electrical conduction in carbon-doped silicon oxide using a voltage ramp method

Yiang, K. Y., Yoo, W. J., Guo, Q., Krishnamoorthy, Ahila

Journal:

Applied Physics Letters

Year:

2003

Language:

english

File:

PDF, 359 KB

english, 2003

12

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Performance properties in thick film silicate dielectric layers using molecular modeling

Iwamoto, Nancy, Krishnamoorthy, Ahila, Spear, Richard, Brouk, Emma, Gebrebrhan, Amanuel, Stifanos, Mehari, Rutter, Ed, Yellowaga, Deb

Year:

2008

Language:

english

File:

PDF, 1.54 MB

english, 2008

13

Electromigration in copper damascene interconnects: reservoir effects and failure analysis

Wei Shao, A.V. Vairagar, Chih-Hang Tung, Ze-Liang Xie, Ahila Krishnamoorthy, S.G. Mhaisalkar

Journal:

Surface and Coatings Technology

Year:

2005

Language:

english

File:

PDF, 390 KB

english, 2005

14

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Understanding leakage current susceptibility in dielectrics using molecular modeling

Iwamoto, Nancy, Krishnamoorthy, Ahila

Year:

2009

Language:

english

File:

PDF, 83 KB

english, 2009

15

A Tertiary Current Distribution Model for the Pulse Plating of Copper into High Aspect Ratio Sub-0.25 μm Trenches

Varadarajan, Desikan, Lee, Charles Y., Krishnamoorthy, Ahila, Duquette, David J., Gill, William N.

Journal:

Journal of The Electrochemical Society

Year:

2000

Language:

english

File:

PDF, 662 KB

english, 2000

16

Effect of surface treatment on electromigration in sub-micron Cu damascene interconnects

A.V. Vairagar, S.G. Mhaisalkar, Ahila Krishnamoorthy

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 544 KB

english, 2004

17

Pad etch optimization to minimize polymer

Xiaomei Bu, Meng Luo, ChianYuh Sin, Fan Zhang, Pradeep Yelehanka, Tae Jong Lee, Ahila Krishnamoorthy

Journal:

Microelectronic Engineering

Year:

2005

Language:

english

File:

PDF, 428 KB

english, 2005

18

Planarization Materials for Active Matrix Thin Film Transistor Arrays

Krishnamoorthy, Ahila, Spear, Richard, Gebrebrhan, Amanuel, Stifanos, Mehari, Bien, Hai, Lowe, Marie, yellowaga, Deborah, Smith, Peter

Journal:

MRS Proceedings

Year:

2007

Language:

english

File:

PDF, 2.19 MB

english, 2007

19

Self-Assembled Monolayers as Cu Diffusion Barriers for Ultralow-k Dielectrics

Murthy, B. Ramana, Yee, Wan Mun, Krishnamoorthy, Ahila, Kumar, R., Frye, D. C.

Journal:

Electrochemical and Solid-State Letters

Year:

2006

Language:

english

File:

PDF, 86 KB

english, 2006

20

Reservoir effect on electromigration mechanisms in dual-damascene Cu interconnect structures

A.V. Vairagar, S.G. Mhaisalkar, M.A. Meyer, E. Zschech, Ahila Krishnamoorthy

Journal:

Microelectronic Engineering

Year:

2005

Language:

english

File:

PDF, 224 KB

english, 2005

21

Spin-on Gate Dielectric Materials for Next Generation Display Systems

Chen, Jinghong, Stifanos, Mehari, Nedbal, Jan, Krishnamoorthy, Ahila, Brouk, Emma, Smith, Pete, Daniels, Brian

Journal:

MRS Proceedings

Year:

2006

Language:

english

File:

PDF, 358 KB

english, 2006

22

SPIE Proceedings [SPIE NanoScience + Engineering - San Diego, California, USA (Sunday 26 August 2007)] Nanoengineering: Fabrication, Properties, Optics, and Devices IV - Dielectric constant trends in silicate spin-on glasses

Iwamoto, Nancy, Dobisz, Elizabeth A., Eldada, Louay A., Li, Tao, Sepa, Jelena, Krishnamoorthy, Ahila

Year:

2007

Language:

english

File:

PDF, 320 KB

english, 2007

23

Effect of Etching Process Deviations and Photoresist Stripping on Contact Yield of Copper Dual Damascene Metallization

Krishnamoorthy, Ahila, Bliznetsov, Vladimir, Tay, Hui Leng, Yu, Bo

Journal:

Journal of The Electrochemical Society

Year:

2002

Language:

english

File:

PDF, 624 KB

english, 2002

24

In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures

Vairagar, A. V., Mhaisalkar, S. G., Krishnamoorthy, Ahila, Tu, K. N., Gusak, A. M., Meyer, Moritz Andreas, Zschech, Ehrenfried

Journal:

Applied Physics Letters

Year:

2004

Language:

english

File:

PDF, 544 KB

english, 2004

25

Effect of ramp rate on dielectric breakdown in CU–SiOC interconnects

K.H. Cheng, Ahila Krishnamoorthy

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 407 KB

english, 2004

26

Electric Field-Enhanced Degradation of Porous Methylsilsesquioxane Polymer as Observed by In Situ FTIRS

Yiang, K. Y., Yoo, W. J., Krishnamoorthy, Ahila

Journal:

Electrochemical and Solid-State Letters

Year:

2004

Language:

english

File:

PDF, 423 KB

english, 2004

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